High Bond Strength Blue Acrylic Thermal Adhesive tape 0.8W/MK
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 0.8 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
| Typical Properties of TIA™800FG Series |
| Product Name | TIATM805FG | TIATM806FG | TIATM808FG | TIATM810FG | TIATM815FG | TIATM820FG | Test Method |
| Color | White | Visual |
| Adhesive Type | Acrylic Adhesive | ******** |
| Backing Type | Glass fiber | ******** |
| Composite Thickness | 0.005" 0.127mm | 0.006" 0.152mm | 0.020" 0.203mm | 0.010" 0.254mm | 0.015" 0.381mm | 0.020" 0.508mm | ASTM D374 |
| Glass fiber Thickness | ±0.001" ±0.025mm | ±0.001" ±0.025mm | ±0.0012" ±0.03mm | ±0.0012" ±0.03mm | ±0.0015" ±0.038mm | ±0.002" ±0.05mm | ASTM D374 |
| Voltage Breakdown | > 2000 Vac | > 2000 Vac | > 2300 Vac | > 3000 Vac | > 3500 Vac | > 3500 Vac | ASTM D149 |
| Peel Adhesion | 1200 g/inch2 | JIS K02378 |
| Holding Power 25℃/Days | > 120 kg/inch2 | JIS K023711 |
| Holding Power 120℃/Hours | > 10 kg/inch2 | JIS K023711 |
| Recommend Using Pressure | 10 psi | ******** |
| Thermal Conductivity | 0.8W/mK | ******** |
| Thermal Impedance@50psi | 0.52℃-in²/W | 0.59℃-in²/W | 0.83℃-in²/W | 0.91℃-in²/W | 1.15℃-in²/W | 1.43℃-in²/W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) 0.006"(0.152mm) 0.008"(0.203mm) 0.010"(0.254mm) 0.015"(0.381mm) 0.020"(0.508mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 18"(254mm x 457mm) 10" x 400'(254mm x 121.9M)
Individual die cut shapes can be supplied.
Reinforcement:
TIA™800 Series sheets are fiberglass reinforced.
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
| Online-service : 12 hours , Inquiry reply within fastest. |
| Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8). |
| Well-trained & experienced staff are to answer all your inquiries in English of course. |
| Standard Export Carton Or Marked With Customer's Information Or Customized. |
| Provide free samples |
| After-service: Even our products have passed strict inspection, if you find the parts can not work well, please show us the proof. |
| we will help you to deal with it and give you satisfactory solution. |
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High Bond Strength Blue Acrylic Thermal Adhesive tape 0.8W/MK Images
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